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IEEE Mini Colloquium on Device and Packaging Innovation for Next-Gen AI/HPC Systems

  • UAlbany ETEC Building 1220 Washington Avenue Albany, NY, 12226 United States (map)

A series of speakers covering device and packaging innovations for next-gen AI/HPC systems.  Registration is free but mandatory.   Breakfast and lunch will be provided for all registered attendees.  Parking information will be sent out after registration.

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April 16

College Student Pitch Night - SUTV

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April 22

Are You Leaving Money on the Table? R&D Tax Credits, Demystified